Commit Graph

11 Commits

Author SHA1 Message Date
Joe Perches
5713017ec5 hwmon: (lm70) Use pr_fmt and pr_<level>
Added #define pr_fmt KBUILD_MODNAME ": " fmt
Converted printks to pr_<level>
Coalesced any long formats
Removed prefixes from formats

Signed-off-by: Joe Perches <joe@perches.com>
Signed-off-by: Guenter Roeck <guenter.roeck@ericsson.com>
2011-01-08 10:55:15 -08:00
Tejun Heo
5a0e3ad6af include cleanup: Update gfp.h and slab.h includes to prepare for breaking implicit slab.h inclusion from percpu.h
percpu.h is included by sched.h and module.h and thus ends up being
included when building most .c files.  percpu.h includes slab.h which
in turn includes gfp.h making everything defined by the two files
universally available and complicating inclusion dependencies.

percpu.h -> slab.h dependency is about to be removed.  Prepare for
this change by updating users of gfp and slab facilities include those
headers directly instead of assuming availability.  As this conversion
needs to touch large number of source files, the following script is
used as the basis of conversion.

  http://userweb.kernel.org/~tj/misc/slabh-sweep.py

The script does the followings.

* Scan files for gfp and slab usages and update includes such that
  only the necessary includes are there.  ie. if only gfp is used,
  gfp.h, if slab is used, slab.h.

* When the script inserts a new include, it looks at the include
  blocks and try to put the new include such that its order conforms
  to its surrounding.  It's put in the include block which contains
  core kernel includes, in the same order that the rest are ordered -
  alphabetical, Christmas tree, rev-Xmas-tree or at the end if there
  doesn't seem to be any matching order.

* If the script can't find a place to put a new include (mostly
  because the file doesn't have fitting include block), it prints out
  an error message indicating which .h file needs to be added to the
  file.

The conversion was done in the following steps.

1. The initial automatic conversion of all .c files updated slightly
   over 4000 files, deleting around 700 includes and adding ~480 gfp.h
   and ~3000 slab.h inclusions.  The script emitted errors for ~400
   files.

2. Each error was manually checked.  Some didn't need the inclusion,
   some needed manual addition while adding it to implementation .h or
   embedding .c file was more appropriate for others.  This step added
   inclusions to around 150 files.

3. The script was run again and the output was compared to the edits
   from #2 to make sure no file was left behind.

4. Several build tests were done and a couple of problems were fixed.
   e.g. lib/decompress_*.c used malloc/free() wrappers around slab
   APIs requiring slab.h to be added manually.

5. The script was run on all .h files but without automatically
   editing them as sprinkling gfp.h and slab.h inclusions around .h
   files could easily lead to inclusion dependency hell.  Most gfp.h
   inclusion directives were ignored as stuff from gfp.h was usually
   wildly available and often used in preprocessor macros.  Each
   slab.h inclusion directive was examined and added manually as
   necessary.

6. percpu.h was updated not to include slab.h.

7. Build test were done on the following configurations and failures
   were fixed.  CONFIG_GCOV_KERNEL was turned off for all tests (as my
   distributed build env didn't work with gcov compiles) and a few
   more options had to be turned off depending on archs to make things
   build (like ipr on powerpc/64 which failed due to missing writeq).

   * x86 and x86_64 UP and SMP allmodconfig and a custom test config.
   * powerpc and powerpc64 SMP allmodconfig
   * sparc and sparc64 SMP allmodconfig
   * ia64 SMP allmodconfig
   * s390 SMP allmodconfig
   * alpha SMP allmodconfig
   * um on x86_64 SMP allmodconfig

8. percpu.h modifications were reverted so that it could be applied as
   a separate patch and serve as bisection point.

Given the fact that I had only a couple of failures from tests on step
6, I'm fairly confident about the coverage of this conversion patch.
If there is a breakage, it's likely to be something in one of the arch
headers which should be easily discoverable easily on most builds of
the specific arch.

Signed-off-by: Tejun Heo <tj@kernel.org>
Guess-its-ok-by: Christoph Lameter <cl@linux-foundation.org>
Cc: Ingo Molnar <mingo@redhat.com>
Cc: Lee Schermerhorn <Lee.Schermerhorn@hp.com>
2010-03-30 22:02:32 +09:00
Anton Vorontsov
8cec03eee4 hwmon: lm70: convert to device table matching
Make the code a little bit nicer, and shorter.

Signed-off-by: Anton Vorontsov <avorontsov@ru.mvista.com>
Cc: Kaiwan N Billimoria <kaiwan@designergraphix.com>
Cc: David Brownell <dbrownell@users.sourceforge.net>
Cc: David Woodhouse <dwmw2@infradead.org>
Cc: Grant Likely <grant.likely@secretlab.ca>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Ben Dooks <ben-linux@fluff.org>
Cc: Benjamin Herrenschmidt <benh@kernel.crashing.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2009-09-23 07:39:43 -07:00
Manuel Lauss
c8ac32e471 hwmon: (lm70) Add TI TMP121 support
The Texas Instruments TMP121 is a SPI temperature sensor very similar
to the LM70, with slightly higher resolution.  This patch extends the
LM70 driver to support the TMP121.  The TMP123 differs in pin assign-
ment.

Signed-off-by: Manuel Lauss <mano@roarinelk.homelinux.net>
Signed-off-by: Jean Delvare <khali@linux-fr.org>
2009-01-07 16:37:34 +01:00
Kaiwan N Billimoria
2b7300513b hwmon: (lm70) Code streamlining and cleanup
This fixes a byteswap bug in the LM70 temperature sensor driver,
which was previously covered up by a converse bug in the driver
for the LM70EVAL-LLP board (which is also fixed).

Other fixes:  doc updates, remove an annoying msleep(), and improve
three-wire protocol handling.

Signed-off-by: Kaiwan N Billimoria <kaiwan@designergraphix.com>
[ dbrownell@users.sourceforge.net: doc and whitespace tweaks ]
Signed-off-by: David Brownell <dbrownell@users.sourceforge.net>
Signed-off-by: Jean Delvare <khali@linux-fr.org>
2009-01-07 16:37:34 +01:00
Matthias Kaehlcke
4bfe66048e hwmon: (lm70) Convert semaphore to mutex
Signed-off-by: Matthias Kaehlcke <matthias.kaehlcke@gmail.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
2007-11-08 08:42:46 -05:00
Tony Jones
1beeffe433 hwmon: Convert from class_device to device
Convert from class_device to device for hwmon_device_register/unregister

Signed-off-by: Tony Jones <tonyj@suse.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
Signed-off-by: Kay Sievers <kay.sievers@vrfy.org>
Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
2007-10-09 22:56:30 -04:00
Jean Delvare
67f921d164 hwmon: (lm70) Add a name attribute
Add a name attribute to the lm70 devices. This is required for
libsensors to recognize them.

Also drop the "+" before the temperature value, even though it did
not cause problems to libsensors, other hardware monitoring drivers
don't print it, so it's more consistent that way.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Hans de Goede <j.w.r.degoede@hhs.nl>
Acked-by: Kaiwan <kaiwan@designergraphix.com>
Signed-off-by: Mark M. Hoffman <mhoffman@lightlink.com>
2007-10-09 22:56:29 -04:00
David Brownell
c06e677aed SPI: add 3wire mode flag
Add a new spi->mode bit: SPI_3WIRE, for chips where the SI and SO signals
are shared (and which are thus only half duplex).  Update the LM70 driver
to require support for that hardware mode from the controller.

Signed-off-by: David Brownell <dbrownell@users.sourceforge.net>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2007-07-17 10:23:04 -07:00
Ralf Baechle
41be722b61 hwmon/lm70: Make lm70_remove a __devexit function
This fixes a potential broken reference.

Signed-off-by: Ralf Baechle <ralf@linux-mips.org>
Signed-off-by: Jean Delvare <khali@linux-fr.org>
2007-02-14 21:15:04 +01:00
Kaiwan N Billimoria
e1a8e913f9 [PATCH] lm70: New hardware monitoring driver
This driver implements support for the National Semiconductor LM70
temperature sensor.

The LM70 temperature sensor chip supports a single temperature sensor.
It communicates with a host processor (or microcontroller) via an
SPI/Microwire Bus interface.

Communication with the LM70 is simple: when the temperature is to be sensed,
the driver accesses the LM70 using SPI communication: 16 SCLK cycles
comprise the MOSI/MISO loop. At the end of the transfer, the 11-bit 2's
complement digital temperature (sent via the SIO line), is available in the
driver for interpretation. This driver makes use of the kernel's in-core
SPI support.

Signed-off-by: Kaiwan N Billimoria <kaiwan@designergraphix.com>
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
2006-06-22 11:10:35 -07:00