kernel-ark/drivers/hwmon/pkgtemp.c

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x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
/*
* pkgtemp.c - Linux kernel module for processor package hardware monitoring
*
* Copyright (C) 2010 Fenghua Yu <fenghua.yu@intel.com>
*
* Inspired from many hwmon drivers especially coretemp.
*
* This program is free software; you can redistribute it and/or modify
* it under the terms of the GNU General Public License as published by
* the Free Software Foundation; version 2 of the License.
*
* This program is distributed in the hope that it will be useful,
* but WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
* GNU General Public License for more details.
*
* You should have received a copy of the GNU General Public License
* along with this program; if not, write to the Free Software
* Foundation, Inc., 51 Franklin Street, Fifth Floor, Boston, MA
* 02110-1301 USA.
*/
#define pr_fmt(fmt) KBUILD_MODNAME ": " fmt
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
#include <linux/module.h>
#include <linux/init.h>
#include <linux/slab.h>
#include <linux/jiffies.h>
#include <linux/hwmon.h>
#include <linux/sysfs.h>
#include <linux/hwmon-sysfs.h>
#include <linux/err.h>
#include <linux/mutex.h>
#include <linux/list.h>
#include <linux/platform_device.h>
#include <linux/cpu.h>
#include <asm/msr.h>
#include <asm/processor.h>
#include <asm/smp.h>
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
#define DRVNAME "pkgtemp"
enum { SHOW_TEMP, SHOW_TJMAX, SHOW_TTARGET, SHOW_LABEL, SHOW_NAME };
/*
* Functions declaration
*/
static struct pkgtemp_data *pkgtemp_update_device(struct device *dev);
struct pkgtemp_data {
struct device *hwmon_dev;
struct mutex update_lock;
const char *name;
u32 id;
u16 phys_proc_id;
char valid; /* zero until following fields are valid */
unsigned long last_updated; /* in jiffies */
int temp;
int tjmax;
int ttarget;
u8 alarm;
};
/*
* Sysfs stuff
*/
static ssize_t show_name(struct device *dev, struct device_attribute
*devattr, char *buf)
{
int ret;
struct sensor_device_attribute *attr = to_sensor_dev_attr(devattr);
struct pkgtemp_data *data = dev_get_drvdata(dev);
if (attr->index == SHOW_NAME)
ret = sprintf(buf, "%s\n", data->name);
else /* show label */
ret = sprintf(buf, "physical id %d\n",
data->phys_proc_id);
return ret;
}
static ssize_t show_alarm(struct device *dev, struct device_attribute
*devattr, char *buf)
{
struct pkgtemp_data *data = pkgtemp_update_device(dev);
/* read the Out-of-spec log, never clear */
return sprintf(buf, "%d\n", data->alarm);
}
static ssize_t show_temp(struct device *dev,
struct device_attribute *devattr, char *buf)
{
struct sensor_device_attribute *attr = to_sensor_dev_attr(devattr);
struct pkgtemp_data *data = pkgtemp_update_device(dev);
int err = 0;
if (attr->index == SHOW_TEMP)
err = data->valid ? sprintf(buf, "%d\n", data->temp) : -EAGAIN;
else if (attr->index == SHOW_TJMAX)
err = sprintf(buf, "%d\n", data->tjmax);
else
err = sprintf(buf, "%d\n", data->ttarget);
return err;
}
static SENSOR_DEVICE_ATTR(temp1_input, S_IRUGO, show_temp, NULL, SHOW_TEMP);
static SENSOR_DEVICE_ATTR(temp1_crit, S_IRUGO, show_temp, NULL, SHOW_TJMAX);
static SENSOR_DEVICE_ATTR(temp1_max, S_IRUGO, show_temp, NULL, SHOW_TTARGET);
static DEVICE_ATTR(temp1_crit_alarm, S_IRUGO, show_alarm, NULL);
static SENSOR_DEVICE_ATTR(temp1_label, S_IRUGO, show_name, NULL, SHOW_LABEL);
static SENSOR_DEVICE_ATTR(name, S_IRUGO, show_name, NULL, SHOW_NAME);
static struct attribute *pkgtemp_attributes[] = {
&sensor_dev_attr_name.dev_attr.attr,
&sensor_dev_attr_temp1_label.dev_attr.attr,
&dev_attr_temp1_crit_alarm.attr,
&sensor_dev_attr_temp1_input.dev_attr.attr,
&sensor_dev_attr_temp1_crit.dev_attr.attr,
NULL
};
static const struct attribute_group pkgtemp_group = {
.attrs = pkgtemp_attributes,
};
static struct pkgtemp_data *pkgtemp_update_device(struct device *dev)
{
struct pkgtemp_data *data = dev_get_drvdata(dev);
unsigned int cpu;
int err;
mutex_lock(&data->update_lock);
if (!data->valid || time_after(jiffies, data->last_updated + HZ)) {
u32 eax, edx;
data->valid = 0;
cpu = data->id;
err = rdmsr_on_cpu(cpu, MSR_IA32_PACKAGE_THERM_STATUS,
&eax, &edx);
if (!err) {
data->alarm = (eax >> 5) & 1;
data->temp = data->tjmax - (((eax >> 16)
& 0x7f) * 1000);
data->valid = 1;
} else
dev_dbg(dev, "Temperature data invalid (0x%x)\n", eax);
data->last_updated = jiffies;
}
mutex_unlock(&data->update_lock);
return data;
}
static int get_tjmax(int cpu, struct device *dev)
{
int default_tjmax = 100000;
int err;
u32 eax, edx;
u32 val;
/* IA32_TEMPERATURE_TARGET contains the TjMax value */
err = rdmsr_safe_on_cpu(cpu, MSR_IA32_TEMPERATURE_TARGET, &eax, &edx);
if (!err) {
val = (eax >> 16) & 0xff;
if ((val > 80) && (val < 120)) {
dev_info(dev, "TjMax is %d C.\n", val);
return val * 1000;
}
}
dev_warn(dev, "Unable to read TjMax from CPU.\n");
return default_tjmax;
}
static int __devinit pkgtemp_probe(struct platform_device *pdev)
{
struct pkgtemp_data *data;
int err;
u32 eax, edx;
#ifdef CONFIG_SMP
struct cpuinfo_x86 *c = &cpu_data(pdev->id);
#endif
data = kzalloc(sizeof(struct pkgtemp_data), GFP_KERNEL);
if (!data) {
err = -ENOMEM;
dev_err(&pdev->dev, "Out of memory\n");
goto exit;
}
data->id = pdev->id;
#ifdef CONFIG_SMP
data->phys_proc_id = c->phys_proc_id;
#endif
data->name = "pkgtemp";
mutex_init(&data->update_lock);
/* test if we can access the THERM_STATUS MSR */
err = rdmsr_safe_on_cpu(data->id, MSR_IA32_PACKAGE_THERM_STATUS,
&eax, &edx);
if (err) {
dev_err(&pdev->dev,
"Unable to access THERM_STATUS MSR, giving up\n");
goto exit_free;
}
data->tjmax = get_tjmax(data->id, &pdev->dev);
platform_set_drvdata(pdev, data);
err = rdmsr_safe_on_cpu(data->id, MSR_IA32_TEMPERATURE_TARGET,
&eax, &edx);
if (err) {
dev_warn(&pdev->dev, "Unable to read"
" IA32_TEMPERATURE_TARGET MSR\n");
} else {
data->ttarget = data->tjmax - (((eax >> 8) & 0xff) * 1000);
err = device_create_file(&pdev->dev,
&sensor_dev_attr_temp1_max.dev_attr);
if (err)
goto exit_free;
}
err = sysfs_create_group(&pdev->dev.kobj, &pkgtemp_group);
if (err)
goto exit_dev;
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
data->hwmon_dev = hwmon_device_register(&pdev->dev);
if (IS_ERR(data->hwmon_dev)) {
err = PTR_ERR(data->hwmon_dev);
dev_err(&pdev->dev, "Class registration failed (%d)\n",
err);
goto exit_class;
}
return 0;
exit_class:
sysfs_remove_group(&pdev->dev.kobj, &pkgtemp_group);
exit_dev:
device_remove_file(&pdev->dev, &sensor_dev_attr_temp1_max.dev_attr);
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
exit_free:
kfree(data);
exit:
return err;
}
static int __devexit pkgtemp_remove(struct platform_device *pdev)
{
struct pkgtemp_data *data = platform_get_drvdata(pdev);
hwmon_device_unregister(data->hwmon_dev);
sysfs_remove_group(&pdev->dev.kobj, &pkgtemp_group);
device_remove_file(&pdev->dev, &sensor_dev_attr_temp1_max.dev_attr);
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
platform_set_drvdata(pdev, NULL);
kfree(data);
return 0;
}
static struct platform_driver pkgtemp_driver = {
.driver = {
.owner = THIS_MODULE,
.name = DRVNAME,
},
.probe = pkgtemp_probe,
.remove = __devexit_p(pkgtemp_remove),
};
struct pdev_entry {
struct list_head list;
struct platform_device *pdev;
unsigned int cpu;
#ifdef CONFIG_SMP
u16 phys_proc_id;
#endif
};
static LIST_HEAD(pdev_list);
static DEFINE_MUTEX(pdev_list_mutex);
static int __cpuinit pkgtemp_device_add(unsigned int cpu)
{
int err;
struct platform_device *pdev;
struct pdev_entry *pdev_entry;
struct cpuinfo_x86 *c = &cpu_data(cpu);
if (!cpu_has(c, X86_FEATURE_PTS))
return 0;
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
mutex_lock(&pdev_list_mutex);
#ifdef CONFIG_SMP
/* Only keep the first entry in each package */
list_for_each_entry(pdev_entry, &pdev_list, list) {
if (c->phys_proc_id == pdev_entry->phys_proc_id) {
err = 0; /* Not an error */
goto exit;
}
}
#endif
pdev = platform_device_alloc(DRVNAME, cpu);
if (!pdev) {
err = -ENOMEM;
pr_err("Device allocation failed\n");
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
goto exit;
}
pdev_entry = kzalloc(sizeof(struct pdev_entry), GFP_KERNEL);
if (!pdev_entry) {
err = -ENOMEM;
goto exit_device_put;
}
err = platform_device_add(pdev);
if (err) {
pr_err("Device addition failed (%d)\n", err);
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
goto exit_device_free;
}
#ifdef CONFIG_SMP
pdev_entry->phys_proc_id = c->phys_proc_id;
#endif
pdev_entry->pdev = pdev;
pdev_entry->cpu = cpu;
list_add_tail(&pdev_entry->list, &pdev_list);
mutex_unlock(&pdev_list_mutex);
return 0;
exit_device_free:
kfree(pdev_entry);
exit_device_put:
platform_device_put(pdev);
exit:
mutex_unlock(&pdev_list_mutex);
return err;
}
static void __cpuinit pkgtemp_device_remove(unsigned int cpu)
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
{
struct pdev_entry *p;
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
unsigned int i;
int err;
mutex_lock(&pdev_list_mutex);
list_for_each_entry(p, &pdev_list, list) {
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
if (p->cpu != cpu)
continue;
platform_device_unregister(p->pdev);
list_del(&p->list);
mutex_unlock(&pdev_list_mutex);
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
kfree(p);
for_each_cpu(i, cpu_core_mask(cpu)) {
if (i != cpu) {
err = pkgtemp_device_add(i);
if (!err)
break;
}
}
return;
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
}
mutex_unlock(&pdev_list_mutex);
}
static int __cpuinit pkgtemp_cpu_callback(struct notifier_block *nfb,
unsigned long action, void *hcpu)
{
unsigned int cpu = (unsigned long) hcpu;
switch (action) {
case CPU_ONLINE:
case CPU_DOWN_FAILED:
pkgtemp_device_add(cpu);
break;
case CPU_DOWN_PREPARE:
pkgtemp_device_remove(cpu);
break;
}
return NOTIFY_OK;
}
static struct notifier_block pkgtemp_cpu_notifier __refdata = {
.notifier_call = pkgtemp_cpu_callback,
};
static int __init pkgtemp_init(void)
{
int i, err = -ENODEV;
/* quick check if we run Intel */
if (cpu_data(0).x86_vendor != X86_VENDOR_INTEL)
goto exit;
err = platform_driver_register(&pkgtemp_driver);
if (err)
goto exit;
for_each_online_cpu(i)
pkgtemp_device_add(i);
#ifndef CONFIG_HOTPLUG_CPU
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
if (list_empty(&pdev_list)) {
err = -ENODEV;
goto exit_driver_unreg;
}
#endif
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
register_hotcpu_notifier(&pkgtemp_cpu_notifier);
return 0;
#ifndef CONFIG_HOTPLUG_CPU
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
exit_driver_unreg:
platform_driver_unregister(&pkgtemp_driver);
#endif
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
exit:
return err;
}
static void __exit pkgtemp_exit(void)
{
struct pdev_entry *p, *n;
x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
2010-07-30 00:13:43 +00:00
unregister_hotcpu_notifier(&pkgtemp_cpu_notifier);
mutex_lock(&pdev_list_mutex);
list_for_each_entry_safe(p, n, &pdev_list, list) {
platform_device_unregister(p->pdev);
list_del(&p->list);
kfree(p);
}
mutex_unlock(&pdev_list_mutex);
platform_driver_unregister(&pkgtemp_driver);
}
MODULE_AUTHOR("Fenghua Yu <fenghua.yu@intel.com>");
MODULE_DESCRIPTION("Intel processor package temperature monitor");
MODULE_LICENSE("GPL");
module_init(pkgtemp_init)
module_exit(pkgtemp_exit)